PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board comprises: a plurality of build-up layers on which a circuit layer and an insulation layer to cover the circuit layer are successively stacked; and a glass layer configured to come into contact with the build-up layer placed on the lowermost position among the plurality of build-up layers and touch the bottom surface of the circuit layer which is included on the build-up layer placed on the lowermost position. The purpose of the present invention is to provide a printed circuit board configured to easily implement a micro circuit and prevent warpage deformation.