| 摘要 |
The present invention discloses a circuit board. The circuit board includes a base layer, a first insulating layer on the base layer, and a wiring part on the first insulating layer. The first insulating layer includes a resin, and a filler dispersed in the resin. The content of the filler is 78wt% to 92wt%. The thickness of the first insulating layer is 30μm to 50μm. So, the circuit board having withstanding voltage and thermal diffusivity can be provided. |
