| 摘要 |
PROBLEM TO BE SOLVED: To reduce wiring inductance in a power module without changing a conventional layout by laying a terminal part while securing an insulation distance and a dielectric voltage of the terminal part, and bending and wiring a DC-side wiring board.SOLUTION: A DC-side wiring board has a DC side of a power module connected to external equipment or the like arranged side by side with the power module. This DC-side wiring board has a terminal for internal connection connecting to a chip-mounted substrate on an internal connection side and a terminal for external connection for connection with the external equipment or the like. Lamination constitution having an insulation layer interposed is formed between a substrate top pattern and a substrate reverse pattern of a conductive metal having a terminal for internal connection and a terminal for external connection respectively. Respective terminal parts of the lamination constitution are bent substantially at right angles so that the terminal for internal connection and the terminal for external connection face in mutually opposite directions.SELECTED DRAWING: Figure 2 |
