发明名称 Arrangement to attach a micromechanical sensor on a support by glueing.
摘要 It is proposed to adhesively bond the support surface (28) of the sensor (8) constructed as a glass/silicon/glass layer structure (packet), in the silicon layer of which a flexural vibrator (37, 38, 39) is constructed, only partly, actually using an accurately defined adhesive-bonding surface (33), to the support. The adhesive-bonding surface (33) is obtained and creep of adhesive is avoided in regions of the supporting surface (29) of the sensor (8) lying outside the adhesive-bonding surface (33) by applying at least one groove (31) in the supporting surface (28). <IMAGE>
申请公布号 EP0644586(A3) 申请公布日期 1996.05.22
申请号 EP19940112914 申请日期 1994.08.19
申请人 MANNESMANN KIENZLE GMBH 发明人 SCHREIBER-PRILLWITZ, WOLFGANG, DIPL.-PHYS.;PLANKENHORN, HORST, DIPL.-ING. (FH);LINDNER, THOMAS, DR. RER. NAT. PHYS.
分类号 G01D21/00;B81B7/00;G01D11/30;G01P1/02;G01P15/08;H01L21/58 主分类号 G01D21/00
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