发明名称 |
Arrangement to attach a micromechanical sensor on a support by glueing. |
摘要 |
It is proposed to adhesively bond the support surface (28) of the sensor (8) constructed as a glass/silicon/glass layer structure (packet), in the silicon layer of which a flexural vibrator (37, 38, 39) is constructed, only partly, actually using an accurately defined adhesive-bonding surface (33), to the support. The adhesive-bonding surface (33) is obtained and creep of adhesive is avoided in regions of the supporting surface (29) of the sensor (8) lying outside the adhesive-bonding surface (33) by applying at least one groove (31) in the supporting surface (28). <IMAGE> |
申请公布号 |
EP0644586(A3) |
申请公布日期 |
1996.05.22 |
申请号 |
EP19940112914 |
申请日期 |
1994.08.19 |
申请人 |
MANNESMANN KIENZLE GMBH |
发明人 |
SCHREIBER-PRILLWITZ, WOLFGANG, DIPL.-PHYS.;PLANKENHORN, HORST, DIPL.-ING. (FH);LINDNER, THOMAS, DR. RER. NAT. PHYS. |
分类号 |
G01D21/00;B81B7/00;G01D11/30;G01P1/02;G01P15/08;H01L21/58 |
主分类号 |
G01D21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|