发明名称 Chemically amplified radiation-sensitive composition
摘要 A chemically amplified-type radiation-sensitive composition comprising: (a) an alkali-soluble binder resin made by a condensation reaction of: (i) hydroxystyrene moiety having formula Ä1Ü or Ä2Ü: <CHEM> <CHEM> wherein x is an integer from 2 to 300; with (ii) a monomethylolated phenolic compound having a formula Ä8Ü: <CHEM> wherein R1 and R2 are individually selected from the group consisting of lower alkyl group having 1-4 carbon atoms, lower alkoxy group having 1-4 carbon atoms, amino group, and carboxylic acid group; wherein R3 and R4 are individually selected from the group consisting of hydrogen, lower alkyl group having 1-4 carbon atoms, lower alkoxy groups having 1-4 carbon atoms, an amino group, and a carboxylic group; and wherein a mole ratio of the hydroxy- styrene moiety to the monomethylolated phenolic compound is from about 1:10 to about 10:1; (b) at least one alkaline dissolution inhibitor containing acid-cleavable groups; and (c) at least one compound that results in generation of an acidic moiety under irradiation.
申请公布号 EP0697632(A3) 申请公布日期 1996.05.22
申请号 EP19950305402 申请日期 1995.08.02
申请人 OCG MICROELECTRONIC MATERIALS, INC. 发明人 HONDA, KENJI
分类号 C08F12/22;C08F12/00;C08F12/24;C08G8/28;C08G8/30;C08G8/38;C08L25/00;C08L25/18;C08L61/00;C08L61/04;C09K13/06;G03F7/004;G03F7/023;G03F7/039;H01L21/027 主分类号 C08F12/22
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