| 摘要 |
1,010,016. Welding by pressure; shearing. SIEMENS & HALSKE A.G. July 15, 1964 [July 23, 1963], No. 29287/64. Headings B3R and B3W. [Also in Division H1] A method of attaching a wire 6 to a semiconductor (not shown) by heat and pressure comprises feeding the wire through a nozzle 5 by which it is pressed against the semi-conductor, and severing the attached wire by shearing blades 8, 9, the blade 8 having a cutting edge located intermediate its thickness and a cam surface 15 for bending over the end of wire remaining in the nozzle so as to prepare the wire for a further attaching operation. When the cutting edges meet, a further cam surface 13 on blade 8 deflects the blade 9, Fig. 6, causing it to pass beneath blade 8. A block 14 guides and/or limits movement of the blade, through contact with the nozzle. The block 14 may be interchangeable or adjustable in order to vary the severance plane. The nozzle 5 may be of glass and the wire 6 of gold. |
