| 摘要 |
<p>A built-up multilayer printed wiring board having excellent appearance and reliability, and a process for producing the same. The wiring board comprises an interlayer insulating layer (4) composed of an adhesive for additive between an inner copper pattern layer (3) having fine irregularities (9) on the surface thereof and an outer copper pattern layer (6), and a metal layer containing one or more metals having ionization tendency stronger than that of copper but smaller than that of titanium or having a noble metal layer (10) deposited on the irregularities (9) of the inner copper pattern layer (3).</p> |
