发明名称 |
Formation of laminated structures by selective dielectric heating of bonding film |
摘要 |
Multiple materials are bonded together by means of an RF-sensitized bonding film or sheet, wherein the RF-sensitized bonding film or sheet is inserted at an intermediate position adjacent to the multiple materials to be bonded, and exposed to a dielectric field for such period of time so as to effect fusion or sintering of the RF-sensitized bonding film or sheet to the multiple materials so as to bond the multiple materials together and form a laminated structure.
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申请公布号 |
US4707402(A) |
申请公布日期 |
1987.11.17 |
申请号 |
US19850786909 |
申请日期 |
1985.10.11 |
申请人 |
PHILLIPS PETROLEUM COMPANY |
发明人 |
THORSRUD, AGMUND K. |
分类号 |
B32B27/16;B29C65/00;B29C65/36;B29C73/00;(IPC1-7):B32B15/00;B32B31/00;B05D3/02 |
主分类号 |
B32B27/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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