| 摘要 |
The present invention relates to a method of manufacturing a heat transfer device, particularly a heat transfer device for cooling electronic components, having a metal plate and a plurality of cylindrical metal pins which are packed relatively densely on the plate and extend perpendicularly therefrom. The inventive method comprises the steps of cleaning the plate (1) and the pins (2) and treating the same with fluxing agent; loading the pins (2) into a pin holding device (4, 7) and affixing the pins by means of said device in mutually radial positions and holding the pins at an axial distance above the plate (1). Solder material (13) is applied to the plate (1) and caused to melt. The pins (2) are then lowered simultaneously down into the molten solder (13) and the solder is caused to solidify while maintaining the pins (2) in their fixed radial positions, whereafter the holder device (4, 7) is removed. The invention also relates to a tool in the form of a holding device intended for use in the manufacture of a heat transfer device and for carrying out the method. |
