| 摘要 |
PURPOSE:To form a high density of bumps with small measurements by a simple procedure in a bump formation method for semiconductor devices. CONSTITUTION:In order to connect electrodes 2 formed on a semiconductor wafer 1, a wire is bonded to electrodes 2, a loop part 3 of the wire which straddles the electrodes 2 is resounded and cut away from a part 4 bonded onto the electrodes 2, and the wire remaining on the electrodes 2 is formed into bumps. |
