发明名称 PACKING TAPE FOR ELECTRONIC DEVICE
摘要 PURPOSE:To prevent the bending or deformation of a lead wire in storage or transit in order to contrive the improvement of productivity by providing the means adapted to locate an emboss tape, a partition emboss tape and a cover tape in predetermined positions in a manner to effect their interengagement. CONSTITUTION:In an embossing process wherein an emboss tape 2 having a separate recess part 2a for receiving each electronic device 3 in such a manner as to make a lead terminal 3a free therefrom and the electronic device 3 received in each recess part 2a can be positioned in a package area 3b over-lying the lead terminal 3a, a partition emboss tape 12 is provided in the position corresponding to the recess part 2a of the emboss tape 2 and a cover tape 11 for covering the partition emboss tape 12 is provided lengthwise thereof. There are further provided means 2b, 12a and 11a adapted to locate the emboss tape 2, the partition emboss tape 12 and the cover tape 11 in predetermined positions in the longitudinal direction in a manner to effect their interengagement.
申请公布号 JPH04294758(A) 申请公布日期 1992.10.19
申请号 JP19910050002 申请日期 1991.03.15
申请人 FUJITSU LTD 发明人 KAGEYAMA RYOCHI
分类号 B65D73/02;H05K13/02 主分类号 B65D73/02
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