| 摘要 |
PURPOSE:To provide a process for producing a ceramic substrate having suppressed warpage. CONSTITUTION:Non-sintered green sheets 11, 12 are placed on the upper and lower faces of a laminate 30 of ceramic green sheets having integrated circuit. A hard porous material 2 is placed on the non-sintered green sheet 11 and the laminate 30 is baked under a load. The laminate 30 of the ceramic green sheets is sintered by this process. The non-sintered green sheets 11, 12 and the hard porous material 2 are removed from the sintered product to obtain a ceramic substrate board. The hard porous material 2 preferably has a porosity of >=30% and the load applied in the baking process is preferably >=0.5 g/cm<2>. When the ceramic green sheet has a cavity, the non-sintered green sheet is preferably placed also in the cavity. |
