发明名称 |
Terminals for a resin-sealed semiconductor device |
摘要 |
A terminal structure for a resin-sealed semiconductor device is formed of a circuit assembly, an outer casing for housing the circuit assembly therein and having a recess for retaining a terminal nut therein, molding resin filled in the outer casing to seal the circuit assembly, and an externally drawn terminal connected to the circuit assembly and extending outwardly through the outer casing. The externally drawn terminal has an external wire connecting portion disposed outside the lid. An anchor or a fixing device is attached to the external wire connecting portion so that the external wire connecting portion is fixed to the casing by two points. |
申请公布号 |
US5373105(A) |
申请公布日期 |
1994.12.13 |
申请号 |
US19930130714 |
申请日期 |
1993.10.04 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
NAGAUNE, FUMIO;MATSUSHITA, HIRAOKI |
分类号 |
H01L23/28;H01L23/04;H01L23/24;H01L23/48;H01L23/495;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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