| 摘要 |
PURPOSE: To provide a gold wire for IC chip bonding wherein disconnection is not generated, when thermocompression bonding jointly using ultrasonic waves whose output is increased is performed, and a loop is formed by executing reverse deformation which severely bends and deforms a ball neck part. CONSTITUTION: The title gold wire contains the following in high purity gold of at least 99.999wt.%; at least one kind out of Ba of 0.0005-0.05wt.%, Be of 0.00002-0.001wt.% and Ge of 0.0001-0.01wt.%. |
