High power digital IC housing

摘要

A housing for a digital IC has (a) a single layer substrate with a preselected pattern of vias (22,25) and bearing lines which extend from bond wiring and flip-chip connections to the vias (22) for producing electrical contact between them; (b) a protective structure arranged such that the vias (22,25), the lines, the wire bond connections, one or more bond wires and one or more support plates (30) are protected against the environment; and (c) electrically conductive balls (17) arranged on a second substrate surface opposite to a first substrate surface bearing the support plate(s) (30). The protective structure may consist of a protective layer (e.g. of polyimide or epoxide resin) extending from the substrate outer edge region to near the bond wire connections, an epoxide resin blob being provided on the housing protection portion of the protective layer and on the bond wire connections, the bond wires and the support plate(s).