Plasma treating apparatus

摘要

A plasma treating apparatus comprising: an evacuable chamber; an electrode in the evacuable chamber electrically connected to a power supply, the electrode producing a process plasma for treating a substrate when the substrate is within the evacuable chamber; and a counter-electrode in the evacuable chamber electrically connected to the power supply , the counter-electrode including a gas flow system to flow gas past the counter-electrode to produce a greater gas pressure around the counter-electrode than other places in the evacuable chamber so that a second relatively dense plasma forms about the counter-electrode to aid in the counter-electrode's operation. <IMAGE>