发明名称 CAPILLARY FOR WIRE BONDING AND WIRE BONDING EQUIPMENT
摘要 PURPOSE: To provide technique wherein wire insertion does not require much time and, in particular, no skill, insertion is facilitated, and a wire is not damaged, regarding a capillary for wire bonding and a wire bonding equipment which are used for wire bonding or the like of a gold wire to a lead frame. CONSTITUTION: A capillary 1 has a wire insertion hole 2 in which a wire (a gold wire or the like) is inserted. The wire is bonded to a part to be connected (a lead frame or the like). An aperture which forms the insertion port 3 of the insertion hole 2 is formed as the constitution spreading in the aperture direction (the outside direction), by forming a planar or curved beveling 31 in the insertion port 3, and making this surface a guide surface for wire insertion.
申请公布号 JPH08191084(A) 申请公布日期 1996.07.23
申请号 JP19950001832 申请日期 1995.01.10
申请人 SONY CORP 发明人 MOKUTA SATORU
分类号 H01L21/60 主分类号 H01L21/60
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