The module has a number of LED components (2) on a first main surface (11) of an electrically insulating circuit board (10) and a cooling device (3) on an opposing second main surface (12), conducting tracks (4) on the first main surface and dust-tight thermally conducting leadthroughs (50) providing a thermally conducting connection from the conducting tracks to the second main surface.
申请公布号
NO20020321(A)
申请公布日期
2002.07.22
申请号
NO20020000321
申请日期
2002.01.21
申请人
OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
发明人
BLUEMEL, SIMON;KREPLIN, ULRICH;ZIMMERMANN, DIRK;HEILMANN, AXEL;ZABEL, MICHAEL