| 摘要 |
<p>A micromachined silicon tuned accelerometer gyro is formed out of silicon wafers, by micromachining. The top and bottom cover which include driver, forcer, tuning and guard ring elements mounted therein are micromachined in arrays on silicon-on-insulator (SOI) wafers. The center (driver and sensing) element between the top and bottom is micromachined in an array of four inch diameter silicon wafers. The driver and sensing structure is a tuned pendulu m attached by flexure joints to a vibrating structure which is suspended by a parallelogram dither suspension. The pendulum is tuned by adjusting the magnitude of a d.c. signal to match the natural frequency of the pendulum to the natural frequency of the vibrating structure. The dither suspension flexures of the vibrating structure is uniquely defined and easily machined but yet provides a dither suspension that restrains the vibrating structure within its vibrating plane with no harmonic distortion.</p> |
