发明名称 PLATED RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a plated resin molding having a high adhesion strength of a plating layer even without being etched with chromic acid. SOLUTION: The plated resin molding is a molded body of a cheleting agent-containing thermoplastic resin with a metal plated layer on the surface and is not etched with an acid containing a heavy metal. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005232338(A) 申请公布日期 2005.09.02
申请号 JP20040043926 申请日期 2004.02.20
申请人 DAICEL POLYMER LTD 发明人 TAI TOSHIHIRO;SOTOZAKI IPPEI
分类号 C08J7/06;C08K5/00;C08L101/00;C23C18/16;C23C18/30;(IPC1-7):C08J7/06 主分类号 C08J7/06
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