METHOD AND APPARATUS FOR PERFORMING MODEL-BASED OPC FOR PATTERN DECOMPOSED FEATURES

摘要

A method and an apparatus for performing model-based OPC(Optical Proximity Correction) for pattern decomposed features are provided to decompose a target circuit pattern containing features to be imaged into multiple patterns for regenerating desired target pattern within an acceptable error criterion with high accuracy. A method for decomposing a target circuit pattern containing features to be printed on a wafer comprises the steps of: splitting the features to be printed into a first pattern and a second pattern(62); performing a first OPC(Optical Proximity Correction) process on the first and second patterns(65); deciding imaging performance of the first and second patterns; deciding a first error between the first pattern and first imaging performance, and a second error between the second pattern and second imaging performance; using the first error in adjustment of the first pattern for generating a corrected first pattern(67); using the second error in adjustment of the second pattern for generating a corrected second pattern; applying a second OPC process on the corrected first and second patterns(69).