| 摘要 |
Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a circuit substrate having a slit inside the circuit substrate, a semiconductor chip formed on an upper surface of the circuit substrate, a wire connecting the semiconductor chip and the circuit substrate through the slit, and a sealant partially covering the wire. According to the semiconductor package, by forming the sealant covering only a part of the wire, wire severing and warping of the semiconductor package can be prevented. In addition, the thickness of a stacked type semiconductor package can be reduced.
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