发明名称 PLASMA TREATMENT APPARATUS AND PLASMA TREATMENT METHOD
摘要 In a plasma oxidation treatment apparatus 100, dual plate structure 60 is arranged above a susceptor 2. An upper plate 61 and a lower plate 62 are made of a dielectric material such as quartz, separately arranged in parallel at a prescribed interval, for instance an interval of 5 mm, and have a plurality of through holes 61a, 62a. The two plates are arranged one over another by shifting the positions so that the through hole 62a of the lower plate 62 and the through hole 61a of the upper plate 61 are not overlapped.
申请公布号 US2009029564(A1) 申请公布日期 2009.01.29
申请号 US20060916166 申请日期 2006.05.30
申请人 TOKYO ELECTRON LIMITED 发明人 YAMASHITA JUN;NAKANISHI TOSHIO;NISHITA TATSUO
分类号 H01L21/31;C23C16/00;H05H1/24 主分类号 H01L21/31
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