| 摘要 |
In the state where the bottom part of the diamond particle is pressed in the grinding tool main body upper side and is adhered with the fixing plating layer, the separation of the diamond particle is prevented while the planarization work of wafer. A manufacturing method using the pressure process of the diamond grinding tool performs the followings: a process of arranging the diamond particle(20) to the grinding tool main body(10) upper side; a process of pressurizing the diamond particle so that a part of the diamond particle be pressed to the grinding tool inner part of the main body; and a process of forming the fixing plating layer(22) for fixing the diamond particle to the upper side of the grinding tool main body. A process of plating the protection plating layer on the fixing plating layer is added after the process of forming the fixing plating layer.
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