An RF(Radio Frequency) switch capable of packaging a plurality of RF switches is provided to perform planarization of a package by connecting a piezoelectric driving part and a signal transmission line to electrode pads through a trench. An RF switch comprises a first substrate(100) and a second substrate(200). Signal transmission lines(111, 112) is wired in the first substrate. Electrode pads are formed on the first substrate. Each pad is connected to the each signal transmission line. The second substrate is bonded on the first substrate. A cantilever(220) is formed on the second substrate. A switch contact part(250) of the cantilever is contacted with the signal transmission lines. A piezoelectric capacitor(240) is formed in the cantilever. A first electrode(241), a piezoelectric film(242), and a second electrode(243) are laminated on the piezoelectric capacitor. When the cantilever is bent by driving the piezoelectric capacitor, the switch contact part is contacted with the signal transmission lines.
申请公布号
KR20090010357(A)
申请公布日期
2009.01.30
申请号
KR20070073408
申请日期
2007.07.23
申请人
LG ELECTRONICS INC.
发明人
KIM, YOUNG SIK;KWON, HYOUK;JANG, SEONG SOO;CHO, IL JOO;PARK, YONG HEE;KIM, YONG DAE;KIM, TAE SIK;NAM, HYO JIN