Coating substrates with an alloy by means of cathode sputtering

摘要

The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and a method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.

主权项

1. A method for coating a plane substrate, which has a width and a length, with an alloy comprising at least a first and a second material as alloy components and having a defined alloy composition by means of magnetron cathode sputtering, comprising:
(a) an elongate magnetron sputtering cathode extending across the width of the substrate and comprising
(a1) a target comprising the alloy components, wherein the surface of the target comprises at least a first section of the first material and a second section of the second material, the first section and the second section adjoin each other and form a common boundary line on the surface of the target, and(a2) a magnet arrangement which is arranged behind the target when viewed from the substrate for forming at least one erosion section on the surface of the target, said magnet arrangement being aligned with its longitudinal direction parallel with respect to the boundary line in a plane parallel to the surface of the target,wherein (b) the erosion section is positioned in the area of the boundary line so that a first part of the erosion section lies on the first target section and a second part of the erosion section lies on the second target section, (c) the substrate is linearly moved in its plane below the target during cathode sputtering, characterized by at least one of the following steps: (d) adjusting the alloy composition before moving the substrate by
(d1) moving the erosion section substantially transversely with respect to the boundary line,(d2) adjusting an acute angle α between the boundary line and the longitudinal direction of the erosion section in a plane parallel to the surface of the target, and(d3) adjusting an angle β between the surface of the magnet arrangement and the surface of the target facing the substrate.