| 摘要 |
FIELD: glueing materials. SUBSTANCE: composition has, mas. p. per 100 mas. p. epoxy diane resin: transamination product of mixture 2-; 2,6-bis-; 2,4,6-tris-(dimethylaminomethyl)-phenols with ethylenediamine 25-35; polyhydroxypropylenepolyol at molecular mass 3500-5000 10-30, and oligohydroxypropyleneamine with terminal hydroxyl-groups and tertiary amino-group 40-60. Composition has additionally epoxy aliphatic resin based on di- and polyols at ratio, mas. p. per 90-95 mas. p. epoxy diane resin, epoxy aliphatic resin based on di- and polyols 5-10. EFFECT: adhesion to metal is increased by 30-45% as compared with that of prototype. |
