发明名称 ENCAPSULANT FOR PACKAGING AN ORGANIC ELECTRIC DEVICE FOR DISPLAY WITH LOW THERMAL EXPANSION COEFFICIENT
摘要 The present invention relates to steel for an organic light emitting diode sealing material for a display having excellent thermal expansion coefficient properties at a high temperature. According to an embodiment of the present invention, the steel for an organic light emitting diode sealing material for a display includes: 0.02 wt% or less of C (excluding 0); 0.4 wt% of less of Si (excluding 0); 0.5 wt% or less of Mn (excluding 0); 3.0 or less wt% of Cr (excluding 0); 40-42 wt% of Ni; 0.6 or less of Co (excluding 0); residual Fe; and other inevitable impurities. The steel satisfies the formula (1) whereas Ni, Cr, and Si in the formula (1) represent the content of each element in wt%.
申请公布号 KR20160079968(A) 申请公布日期 2016.07.07
申请号 KR20140190495 申请日期 2014.12.26
申请人 POSCO 发明人 KIM, KYUNG HUN;KIM, HAK
分类号 C22C38/08;C22C38/40 主分类号 C22C38/08
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