SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING ENCAPSULATION FILM AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to a semiconductor integrated circuit device and a manufacturing method thereof. The semiconductor integrated circuit device includes a resistance layer, and an encapsulation film formed to enclose a side wall of the resistance layer. The encapsulation film includes an oxygen absorbing element. According to the present invention, the semiconductor integrated circuit device can reduce a change in a property of a phase transition layer.