TITANIUM COPPER HAVING PLATING LAYER

摘要

PROBLEM TO BE SOLVED: To provide titanium copper capable of enhancing adhesion strength with solder.SOLUTION: There is provided titanium copper having a mother material containing 1.5 to 5.0 mass% of Ti and the balance copper with inevitable impurities and a plating layer selected from a group consisting of a Ni plating layer, a Co plating layer and a Co-Ni alloy plating layer on a base material surface.SELECTED DRAWING: None