| 摘要 |
FIELD: production of heat-resistant polyphenylene oxide-based materials suitable for use in fabricating construction pieces in electrical engineering, automobile building, chemical engineering, sanitary engineering, medical prosthesis, and film and cover formation. SUBSTANCE: polyphenylene oxide is dissolved at 10-80 C in polimerizable vinylaromatic monomer or in its mixture with an acrylic monomer to be copolymerized at weight ratio 0.8:0.2, respectively, and at total polyphenylene oxide to monomer(s) weight ratio (0.4-1.0):1. Consequent shaping of articles and formation of films and covers is performed simultaneously with copolymerization process. EFFECT: lowered temperatures of polymer processing; simplified technology; possibly modifying polymer by way of inoculating a monomer directly in process of article shaping, film or cover formation. |
