发明名称 Article with electrically-conductive silver connector wire pattern
摘要 Electrically-conductive articles are prepared to have electrically-conductive silver metal electrode grids and electrically-conductive silver connector wire patterns (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive silver connector wire patterns are designed with at least one silver main wire that comprises two or more adjacent silver micro-wires in bundled patterns. These bundled patterns and silver micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such images in a silver halide emulsion layer. The electrically-conductive articles are provided by imagewise exposure, development, and fixing of corresponding silver halide-containing conductive film element precursors containing photosensitive silver halide emulsion layers. The electrically-conductive articles can be used are parts of various electronic devices including touch screen devices.
申请公布号 US9405423(B2) 申请公布日期 2016.08.02
申请号 US201414281923 申请日期 2014.05.20
申请人 EASTMAN KODAK COMPANY 发明人 Lushington Kenneth James;Cok Ronald Steven;Sutton James Edward
分类号 G06F3/047 主分类号 G06F3/047
代理机构 代理人 Tucker J. Lanny
主权项 1. An electrically-conductive article comprising a transparent substrate having a first supporting side and an opposing second supporting side, the first supporting side comprising: an electrically-conductive silver connector wire pattern, and optionally, transparent regions outside of the electrically-conductive silver connector wire pattern, wherein: (i) the electrically-conductive silver connector wire pattern comprises at least one silver main wire that comprises two or more silver micro-wires that are electrically connected to a silver end wire at an end of the at least one silver main wire, the two or more silver micro-wires and the silver end wire in the least one silver main wire forming a bundled pattern; (ii) the average length of each silver micro-wire is at least 1 mm; (iii) the ratio of the average width of each silver micro-wire to the average distance between two adjacent silver micro-wires in each bundled pattern is at least 0.5:1 but less than 2:1; (iv) the electrically-conductive silver connector wire pattern has an integrated transmittance of less than 68%; and (v) for each silver micro-wire, the ratio of maximum height to minimum height is at least 1.05:1.
地址 Rochester NY US