发明名称 |
Article with electrically-conductive silver connector wire pattern |
摘要 |
Electrically-conductive articles are prepared to have electrically-conductive silver metal electrode grids and electrically-conductive silver connector wire patterns (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive silver connector wire patterns are designed with at least one silver main wire that comprises two or more adjacent silver micro-wires in bundled patterns. These bundled patterns and silver micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such images in a silver halide emulsion layer. The electrically-conductive articles are provided by imagewise exposure, development, and fixing of corresponding silver halide-containing conductive film element precursors containing photosensitive silver halide emulsion layers. The electrically-conductive articles can be used are parts of various electronic devices including touch screen devices. |
申请公布号 |
US9405423(B2) |
申请公布日期 |
2016.08.02 |
申请号 |
US201414281923 |
申请日期 |
2014.05.20 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
Lushington Kenneth James;Cok Ronald Steven;Sutton James Edward |
分类号 |
G06F3/047 |
主分类号 |
G06F3/047 |
代理机构 |
|
代理人 |
Tucker J. Lanny |
主权项 |
1. An electrically-conductive article comprising a transparent substrate having a first supporting side and an opposing second supporting side,
the first supporting side comprising: an electrically-conductive silver connector wire pattern, and optionally, transparent regions outside of the electrically-conductive silver connector wire pattern, wherein: (i) the electrically-conductive silver connector wire pattern comprises at least one silver main wire that comprises two or more silver micro-wires that are electrically connected to a silver end wire at an end of the at least one silver main wire, the two or more silver micro-wires and the silver end wire in the least one silver main wire forming a bundled pattern; (ii) the average length of each silver micro-wire is at least 1 mm; (iii) the ratio of the average width of each silver micro-wire to the average distance between two adjacent silver micro-wires in each bundled pattern is at least 0.5:1 but less than 2:1; (iv) the electrically-conductive silver connector wire pattern has an integrated transmittance of less than 68%; and (v) for each silver micro-wire, the ratio of maximum height to minimum height is at least 1.05:1. |
地址 |
Rochester NY US |