Optical module

摘要

An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

主权项

1. An optical module, comprising:
a circuit board; a photoelectric conversion element mounted on the circuit board; an optical connector for optically connecting the photoelectric conversion element and an optical fiber; a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element; a pressing member for pressing and fixing the optical connector to the circuit board; and a supporting member for supporting the pressing member, wherein the circuit board comprises a plurality of electrodes on a non-mounting surface that is opposite to a mounting surface with the semiconductor circuit element mounted thereon, wherein the supporting member comprises an attaching portion to be fixed to a counterpart board that has a plurality of counterpart electrodes electrically connected to the plurality of electrodes, wherein the supporting member integrally comprises a main body extending in a direction and a pair of arm portions extending in a second direction from both ends of the main body in the first direction so as to sandwich the optical connector, wherein the first direction intersects with an extending direction of the optical fiber held by the optical connector and the second direction is orthogonal to the first direction, wherein protrusions are formed on the pair of arm portions, wherein the pressing member is an elastic plate and comprises a plate-shaped pressing-down portion and a pair of locked portions formed on both ends of the pressing member so as to sandwich the pressing-down portion, wherein through-holes to be fitted to the protrusions are formed on the pair of locked portions, wherein the supporting member comprises a heat-absorbing surface and a heat-dissipating surface, wherein the heat-absorbing surface is thermally connected to the semiconductor circuit element, and wherein the heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.