Semiconductor module

摘要

A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.

主权项

1. A semiconductor module comprising:
a substrate; a control device mounted on a bottom surface of the substrate; a buffer semiconductor device mounted on the bottom surface of the substrate; a memory device mounted on the bottom surface of the substrate; a heat-transferring part contacting the control device; an electrical connector that is configured to connect the semiconductor module to an external device and that is provided on a side surface of the substrate and contacting the heat-transferring part; a passive device pad disposed on a top surface of the substrate; a passive device disposed on the passive device pad; a thermoelectric pad disposed on the passive device; and a case contacting the thermoelectric pad and surrounding the substrate, the passive device pad, the passive device, and the thermoelectric pad.