Semiconductor package with coated side walls and method of manufacture

摘要

A semiconductor package including an integrated device, the package having a front side, a back side and side walls linking the front and back sides, wherein each side wall is coated, to at least 80% of its area, with a coating material different from the material(s) of the back and front sides. A method of manufacturing a semiconductor package by providing an assembly containing an array of the packages, the assembly having thickness d0 and being attached to a dicing tape of thickness dd, fabricating a set of first dicing streets with width w1 and depth d1<(d0+dd), filling the first dicing streets at least partially with a coating material, and fabricating, in the coating material in each first dicing street, a second dicing street with width w2≦w1 and depth d2≧d0 but <(d0+dd).

主权项

1. A semiconductor package, comprising
an integrated device comprising a sensitive element, a front side of a material A wherein material A represents a packaging for the integrated device, a back side of a material B opposite to the front side, side walls that link the front side and the back side, each side wall being coated with a coating material to at least 80% of its area, the coating material being different from the material A and being different from the material B, wherein one of:
the front side is free from the coating material; orthe coating material coated on at least one of the side walls wraps around a lateral end of the front side and covers less than 20% of the area of the front side.