发明名称 |
STACK CAPACITOR MANUFACTURING METHOD |
摘要 |
The method of forming stacked capacitor comprises the steps of : forming a charge storage electrode contact hole on a source region(5) after forming a third insulating film(10) on a second flattened insulating film(9); depositing a forth insulating film(12) on a first polysilicone film(11) after depositing the first polysilicone film(11); partial etching of the first polysilicone film(11); forming a fifth insulating film spacer(14) by blanket etch after removing the forth insulating film(14) and depositing a fifth insulating film; forming a charge storage electrode by wet etching of the third insulating film(10) and the fifth insulating layer spacer(14) after blanket etch of the first polysilicone film(11); and forming a plate electrode by depositing a second polysilicone(11') after forming a dielectric film(15) over the whole surface of the wafer.
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申请公布号 |
KR960011660(B1) |
申请公布日期 |
1996.08.24 |
申请号 |
KR19930008078 |
申请日期 |
1993.05.11 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
KEUM, DONG - RYUL |
分类号 |
H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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