发明名称 STACK CAPACITOR MANUFACTURING METHOD
摘要 The method of forming stacked capacitor comprises the steps of : forming a charge storage electrode contact hole on a source region(5) after forming a third insulating film(10) on a second flattened insulating film(9); depositing a forth insulating film(12) on a first polysilicone film(11) after depositing the first polysilicone film(11); partial etching of the first polysilicone film(11); forming a fifth insulating film spacer(14) by blanket etch after removing the forth insulating film(14) and depositing a fifth insulating film; forming a charge storage electrode by wet etching of the third insulating film(10) and the fifth insulating layer spacer(14) after blanket etch of the first polysilicone film(11); and forming a plate electrode by depositing a second polysilicone(11') after forming a dielectric film(15) over the whole surface of the wafer.
申请公布号 KR960011660(B1) 申请公布日期 1996.08.24
申请号 KR19930008078 申请日期 1993.05.11
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 KEUM, DONG - RYUL
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L27/04
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