| 摘要 |
The pattern is used to connect lead(11) pins to a tester at the testing time of a semiconductor device(10). The pattern comprises an insulating plate(41) for including the testing package, a plurality of contact pad(43)s for connecting electrically the insulating plate(41) to the lead pins of the package. Here, a height of an upper layer and surface of the insulating plate(41) is same, and a guide(45) has higher protrusion than a surface of the insulating plate(41).
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