| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate polishing device and a substrate polishing method which highly accurately conducts polishing to flatten a substrate such as a semiconductor wafer or the like. <P>SOLUTION: The substrate polishing device includes: a polishing table having a polishing surface; a substrate retaining device for retaining the substrate to be polished and pushing the same against the polishing surface of the polishing table; and a film thickness measuring device for measuring the thickness of a film formed on the substrate. The substrate retaining device has a regulating means for dividing the substrate contacted in a sliding action with the polishing surface of the polishing table into many regions to regulate a pushing force for pushing the substrate against the polishing surface in each region. The pushing force applied on each region of the substrate on the substrate retaining device is regulated based on the measuring information on the thickness of the film on the substrate, which is measured by the film thickness measuring device. The film thickness measuring device measures the film thickness in each region on the substrate, and the pushing force applied on each region of the substrate on the substrate retaining device is regulated based on the measuring information on the film thickness in each region. <P>COPYRIGHT: (C)2007,JPO&INPIT |
