发明名称 |
Wiring arrangement switching body with associated circuit board and body |
摘要 |
A body (1) for a wiring arrangement has switching path conductors forming a specific pattern each conductor (1a,1b,1c,1d,1e) having a particular shape and sepd. from each other by an insulating resin (2). The switching pattern appears on both faces of the body (1). Prodn. of a wiring arrangement body (1) involves: (a) cutting grooves in a plate of highly conductive material to give a specific switching pattern; (b) casting an insulating resin into the grooves; (c) cutting the conductive material away normal to the base of the grooves to reveal the conductive material pattern (a1-1e) surrounded by resin (2). Other process variations are also claimed. The circuit board itself is also claimed. |
申请公布号 |
DE19607974(A1) |
申请公布日期 |
1996.09.05 |
申请号 |
DE1996107974 |
申请日期 |
1996.03.01 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
HAYASHI, SATORU, TOKIO/TOKYO, JP |
分类号 |
H05K1/02;H01B5/14;H01B13/00;H01L21/48;H01L23/538;H05K3/00;H05K3/04;H05K3/06;H05K3/20;H05K7/06;(IPC1-7):H05K1/02;H05K7/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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