发明名称 Wiring arrangement switching body with associated circuit board and body
摘要 A body (1) for a wiring arrangement has switching path conductors forming a specific pattern each conductor (1a,1b,1c,1d,1e) having a particular shape and sepd. from each other by an insulating resin (2). The switching pattern appears on both faces of the body (1). Prodn. of a wiring arrangement body (1) involves: (a) cutting grooves in a plate of highly conductive material to give a specific switching pattern; (b) casting an insulating resin into the grooves; (c) cutting the conductive material away normal to the base of the grooves to reveal the conductive material pattern (a1-1e) surrounded by resin (2). Other process variations are also claimed. The circuit board itself is also claimed.
申请公布号 DE19607974(A1) 申请公布日期 1996.09.05
申请号 DE1996107974 申请日期 1996.03.01
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 HAYASHI, SATORU, TOKIO/TOKYO, JP
分类号 H05K1/02;H01B5/14;H01B13/00;H01L21/48;H01L23/538;H05K3/00;H05K3/04;H05K3/06;H05K3/20;H05K7/06;(IPC1-7):H05K1/02;H05K7/02 主分类号 H05K1/02
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