| 摘要 |
<p>PURPOSE:To enable to join a semiconductor chip to a housing without generating the trouble of thermal stress by flattening the tip of an intermediate thermal conductor which contacts the semiconductor chip and using a low melting point metal for the thermal conductive substance between the intermediate thermal conductor and the housing. CONSTITUTION:A plurality of the semiconductor chips 4 are joined by phase down to a substrate 6 by means of solder balls 8. As the intermediate thermal conductor, one end surfaces of caps 9 are uniformly joined to the back surfaces of these semiconductor chips, and the inside thereof is charged with a fluid body 10 of good thermal conductivity such as the low melting point metal liquified in the range of operating temperature for the electronic apparatus or thermal conductive wax. The space between the housing 1 and the substrate 6 is filled with a coolant 7. The housing 1 is brought in close contact with a cooler 14 which is formed of a high thermal conductive material and has a cooling water passage 13.</p> |
