| 摘要 |
PURPOSE:To obtain the title low-stress composition excellent in moldability,m cracking resistance after heat shock and moisture resistance and useful for semiconductor sealing, comprising a thermoplastic resin of a specified softening point and a specified organopolysiloxane. CONSTITUTION:An epoxy resin (A) (e.g., novolak epoxy resin) is mixed with 0.5-1.2 equivalent, per epoxy equivalent of component A, of a curing agent (B) (e.g., phthalic anhydride), a cure accelerator (C) (e.g., trimethylamine), 1-10wt% thermoplastic resin (D) (e.g., polycarbonate) of a softening point >=150 deg.C, preferably, of 150-260 deg.C and 0.1-10wt% organopolysiloxane (E) such as a silicone oil, a silicone resin, a silicone rubber or a modified product or derivative thereof.
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