发明名称 MASS SOLDERNG SYSTEM
摘要 <p>MASS SOLDERING SYSTEM A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The impinging fluid stream is rapidly oscillated to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.</p>
申请公布号 CA1249066(A) 申请公布日期 1989.01.17
申请号 CA19860521541 申请日期 1986.10.28
申请人 HOLLIS AUTOMATION, INC. 发明人 BOYNTON, KENNETH G.
分类号 B23K1/08;H05K3/34;(IPC1-7):B23K1/00;B23K31/02 主分类号 B23K1/08
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