| 摘要 |
<p>PURPOSE:To prevent O2-containing bubbles from being formed between a wafer and a protective tape by a method wherein, when the protective tape is stuck to the wafer, N2 gas is sprayed on the adhering surface through a nitrogen injection mechanism. CONSTITUTION:A nitrogen injection mechanism 6 and a pressing mechanism 7 are held by rails 5 in such a way as to freely slide. In case a protective tape 1 is stuck to a wafer 2, N2 gas is sprayed on the wafer 2 through small holes provided on a pipe of the above mechanism 6 and the air existing in the vicinity of the wafer 2 is substituted with N2. In this state, the tape 1 is superposed on the wafer 2. Then, N2 gas is injected through small holes provided on a pipe of the mechanism 7 and the tape 1 is pressed on the wafer 2 by the injection pressure. According to such a way, bubbles can be prevented from being formed between the wafer and the protective tape.</p> |
