| 摘要 |
A surface acoustic wave (SAW) device is mounteed in such a manner that its functional surface faces a base plate and a space is formed therebetween to avoid inferiority in device characteristics. Electrodes of the SAW device and bumps formed on electrodes at predetermined positions of the base plate are connected to each other by applying pressure and heat to secure electrical continuity. A peripheral surface of the SAW device is bonded to the base plate by an adhesive to seal the functional surface of the SAW device.
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