发明名称 MANUFACTURING DEVICE FOR SEMICONDUCTOR AND ITS MANUFACTURE
摘要 <p>PURPOSE:To enable a state of abrasive grains to be grasped in dicing by a method wherein a dicing blade is equipped with a surface roughness measuring mechanism by which surface roughness of said blade is measured. CONSTITUTION:A surface roughness measuring device 5 is established to a side of a dicing blade 1, and surface roughness of the dicing blade 1 is measured with a contact needle 5a extending to an edge of the dicing blade 1. This contact needle 5a is capable of expansion and contraction, for instance, in a horizontal direction normal to an output axis, and can be transferred not to disturb dicing operation. Further, this surface roughness measuring device 5 has a computer built-in, and whether a measured value is not less than or under a critical value is mechanically judged. In that case, when the measured value is not less than the critical value, abrasive grains exist enough. Then, dicing is continued. When under the critical value, the abrasive grains have slipped off and there is a fear of blade cracking. Therefore, the dicing is interrupted and the dicing blade 1 is exchanged.</p>
申请公布号 JPH02184410(A) 申请公布日期 1990.07.18
申请号 JP19890003500 申请日期 1989.01.10
申请人 SUMITOMO ELECTRIC IND LTD 发明人 NISHIGUCHI KATSUNORI;GOTO NOBORU
分类号 B28D5/00;H01L21/301;H01L21/78 主分类号 B28D5/00
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