| 摘要 |
<p>PURPOSE:To reduce the size and to mount/dismount a microcomputor freely by mounting only the microcomputor on a wiring board, accommodating the wiring board in a hole made at a desired position of a casing member, and pressing the wiring board through a conductive sheet in order to make connection with conducting paths formed on a substrate. CONSTITUTION:Power circuit elements 4 producing heat are mainly mounted on a substrate 2 superposed by a wiring board 8, and a plurality of circuit elements 4 such as chip capacitors are mounted substantially on the entire area of the substrate 2. A plurality of circuit elements 4 and electronic parts 13 mounted on the substrate 2 are encapsulated in a sealed space 14 defined by a casing member 6 and the substrate 2, and only the wiring board 8 mounting a microcomputor 7 is sealed hermetically by the casing member 6 and a cover body 17. A hole 5 is made at a desired position of the casing member 6, and the wiring board 8 mounting the microcomputor 7 is disposed and accommodated in a space defined by the hole 5 and then a press means makes connection between the wiring board 8 and conducting paths 3 through a conductive sheet 15. By such arrangement, the microcomputor 7 having reduced size can be mounted/dismounted freely.</p> |
