| 摘要 |
PURPOSE:To prevent the deposition of gold on a substrate resulting from protrusion from fine copper circuits, etc., by carrying out undercoat plating by using, e.g. a bath containing water-soluble gold compound at the time of applying the prescribed gold plating to a copper material using a plastic film as a substrate. CONSTITUTION:Gold striking is applied to a copper material using a plastic film (e.g. of polyimide or polyamide) as a substrate by using a water-soluble gold plating bath. A gold plating bath which contains a water-soluble gold sulfite compound free of alkali metal ions and a water-soluble sulfite and further contains a compound selected from water-soluble polyamine, water-soluble polyamino carboxylic acid, etc., and a compound selected from quinoline, hydroxyquinoline, etc., is prepared. Gold palting is applied to the above- mentioned undercoat-plated copper material by using the above gold plating bath. |
