发明名称 RESIN COMPOSITION, SOLDER RESIST RESIN COMPOSITION, AND ITS CURED ARTICLE
摘要 <p>PURPOSE:To improve developability, photosensitivity, adhesive properties, electrical insulating properties, resistance to electrolytic corrosion, etc., by compounding a specific photosensitive prepolymer, a diluent, a photopolymn. initiator, and a photopolymn. accelerator. CONSTITUTION:21-84wt.% photosensitive prepolymer having at least two ethylenically unsatd. bonds in the molecule, 11-78wt.% diluent comprising a photopolymerizable vinyl monomer and/or an org. solvent, 0.5-25wt.% compd. of formula I (where R1, R2, and R3 are each H, Cl, Br, F, 1-5C alkyl, or 1-5C alkoxy excluding when they all are H) as the photopolymn, initiator, and 0.05-25wt.% compd. of formula II (wherein R4 an R5 are each 1-3C alkyl; R6 is -OR7,-OCH2CH2CH2OR7, H, 1-13C alkyl, phenyl, or a group of formula III; and R7 is 1-13C alkyl) as the photopolymn. accelerator are compounded.</p>
申请公布号 JPH06329971(A) 申请公布日期 1994.11.29
申请号 JP19930136946 申请日期 1993.05.17
申请人 NIPPON KAYAKU CO LTD 发明人 KUDO SHOJI;ISOBE KOJI;TANIGUCHI NOBUO;YOKOSHIMA MINORU
分类号 C08F2/50;C08F290/00;C09D11/033;C09D11/10;C09D11/101;C09D11/102;C09D11/106;G03F7/027;G03F7/031;H05K3/28;(IPC1-7):C09D11/10 主分类号 C08F2/50
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