发明名称 Rated melt point programmable by laser beam e.g. for monolithic i.c. storage device
摘要 The melting spot structure in an integrated circuit coupler transverse coupling lines forming on an insulating layer on a semiconductor substrate for connections between elements of the integrated circuit. An elongated, metal rated melting spot coupler two segments of an intermediate coupling line. It has an integral finger, coupled in coplanar manner to the rated melting spot, from which it extends transversely for energy retaining, radiated from the laser beam. It reduces the laser energy required for melting the melting spot structure.
申请公布号 DE19620549(A1) 申请公布日期 1996.12.12
申请号 DE1996120549 申请日期 1996.05.22
申请人 INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US 发明人 LEE, PEI-ING PAUL, LAGRANGEVILLE, N.Y., US;PREIN, FRANK, WAPPINGERS FALLS, N.Y., US
分类号 B23K26/00;H01L21/302;H01L21/461;H01L21/82;H01L21/822;H01L21/8242;H01L23/525;H01L27/04;H01L27/108;(IPC1-7):H01L23/525 主分类号 B23K26/00
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