发明名称 CURABLE FILM-FORMING COMPOSITIONS CONTAINING AMIDE FUNCTIONAL POLYMERS
摘要 <p>A film-forming composition is provided comprising: (i) an amide functional polymer, copolymer or oligomer selected from (a) acrylic polymers, (b) polyesters, (c) polyurethanes, (d) polyethers or (e) mixtures thereof; and (ii) an aminoplast cross-linking agent containing methylol and/or methylol ether groups. The acrylic polymers have a plurality of groups of at least one of the structures of (V) and (II) wherein n is 0 or 1, R1 is hydrogen or methyl, R2 is a divalent linking group having about 1 to 30 carbon atoms when the group is of the first structure, or R2 is alkylene having about 2 to 13 carbon atoms when the group is of structure (II), and R3 is hydrogen or lower alkyl having 1 to 4 carbon atoms. The (b), (c), and (d) polymers each have a plurality of terminal amide groups. The film-forming composition prior to curing has a theoretical hydroxyl value less than about 50 based on total resin solid weight of the film-forming composition, excluding any hydroxyl functionality associated with N-methylol groups. Aftercuring, the film-forming composition exhibits a high level of acid etch resistance. A multi-component composite coating composition is also provided. The coating composition comprises a pigmented film-forming composition serving as a base coat and a clear film-forming composition serving as a transparent coat over the top of the base coat. The transparent clear coat is derived from the curable film-forming composition described above.</p>
申请公布号 WO1998003599(A1) 申请公布日期 1998.01.29
申请号 US1997012453 申请日期 1997.07.17
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